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  1. Fraunhofer IZM Assembly and Packaging Technologies for Microsystems

    The Fraunhofer IZM is one of the leading institutes for product-focused development of advanced packaging technologies for microelectronics and microsystems ...
    Design7
    Packaging3
    Advanced3
    Technologies3
    Simulation2
    Chip2
    Reliability2
    Composites2
    Environmental Engineering1
    Failure Analysis1
    photonics1
    Microelectronics1
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    Mechatronics1
    Bumping1
    Polymer Materials1
    High Density Interconnect1
    Microelectronic Packaging1
    eGrain1
    Board Interconnection0
    e-Grain0
    Fraunhofer IZM0
    Micromechanical Systems0
    Waferlevel0

    www.izm.fhg.de - 2009-01-28

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